What Are the Factors Endangering the Quality of Electroplating Process in PCB Electroplating

In PCB electroplating, the main salt refers to the salt that can accumulate the specified coating metal material on the negative electrode in the plating solution to produce metal ions. The main salt content in the plating solution must be in an appropriate range, and the main salt content increases

In some cases, if the metal ions of the main salt in the plating solution are simple ions, the coating crystal is strong. Therefore, the plating solution with complexing positive ions should be selected. The way to obtain the complexation positive ions is to add complexing agents, that is, the chemical substances that can complexate the metal ions of the main salt to produce complex ions. Complex ion is a kind of "molecular structure chemical substance" produced by the interaction of simple chemical substances. In the plating solution containing complex ions, the relative components of the main salt and the complexing agent, that is, the dispersion of the complexing agent, rather than the positive components, endanger the actual effect of the electroplating process.

Buffer refers to the chemical substance used to stabilize the pH and pH of aqueous solution. Such compounds are generally composed of weak acid and weak acid salts or alkaline and alkaline salts, which can reduce the change range of pH value of aqueous solution when the aqueous solution meets alkali or acid.Preservative refers to the chemical substances that can significantly improve the characteristics of the coating without significantly changing the conductivity of the coating. According to the effect in the plating solution, preservatives can be divided into polishing solution, leveling agent, fog inhibitor, etc.The chemical substances in the plating solution that can promote anodic oxidation activity are called anodic oxidation activators. The function of anodizing activator is to increase the current intensity of anodizing at the beginning of passivation treatment, so as to ensure that the anodizing is active and can melt normally. When the composition of anodizing active agent is not enough, the anodizing melting is abnormal, and the composition of main salt decreases rapidly, which endangers the stability of plating solution. When it is serious, the electroplating process can not be carried out normally.

Factors endangering the quality of electroplating processElectroplating process can use different metal materials, such as hot-dip galvanizing, electroplated nickel plating, stainless steel, etc.PH value, preservative, current intensity, current wave type, temperature and mixing rate.

Editing: hfy